How to improve the moisture resistance of magnesium oxide “thermal conductive filler”?
Hebei Messi Biology Co., Ltd. said that the heat dissipation of electronic devices has become increasingly important because the packaging density of these devices has continued to increase, resulting in a large amount of heat generated in a compact packaging space. Poor heat dissipation will greatly reduce the life and performance stability of electronic products. […]
How to improve the moisture resistance of magnesium oxide “thermal conductive filler”? Read More »